50-01-0584-0029
Description:
SILVER EMI EPOXY 454G
Category:
Integrated Circuit Chip
In-stock:
In Stock
Payment Method:
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Shipping Method:
LCL, AIR, FCL, Express
Specifications
Category:
RF And Wireless
RFI And EMI - Shielding And Absorbing Materials
Adhesive:
-
Product Status:
Active
Thickness - Overall:
-
Package:
Bulk
Series:
CHO-BOND® 584-29
Material:
Epoxy, 2 Part
Mfr:
Parker Chomerics
Shelf Life Start:
Date Of Manufacture
Width:
-
Shape:
-
Length:
-
Shelf Life:
12 Months
Storage/Refrigeration Temperature:
77°F (25°C)
Operating Temperature:
-
Type:
EMI Conductive Adhesive
Base Product Number:
50-01
Introduction
RF EMI EMI Conductive Adhesive CHO-BOND® 584-29 Epoxy, 2 Part X X
Send RFQ
Stock:
In Stock
MOQ: